Packaging substrate and manufacturing method thereof

Details Packaging substrate and manufacturing method thereof Packaging substrate and manufacturing method thereof

2006-12-28

2008-11-04

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Repair or restoration

C257SE21598, C438S107000

Reexamination Certificate

active

07445944

ABSTRACT:
A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

REFERENCES:
patent: 6481098 (2002-11-01), Lin Chen
patent: 6551855 (2003-04-01), Ding et al.
patent: 2005/0160594 (2005-07-01), Sin
patent: 2007/0087630 (2007-04-01), Ku
patent: I237353 (1992-12-01), None
patent: 499750 (2002-08-01), None

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