4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Shin-Hua Chao

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Ball grid array semiconductor package having improved heat...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Circuit substrate and fabrication method thereof

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor
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Flip chip package process

Electrical connectors – With circuit conductors and safety grounding provision – Grounding of coupling part
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Heat-spread substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Method of attaching a heat sink to an IC package

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-2111321

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