4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Stephen L. James

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Apparatus and method for reducing interposer compression...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Apparatus and method for reducing interposer compression...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Gate area relief strip for a molded I/C package

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Gate area relief strip for a molded I/C package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Leadframe alteration to direct compound flow into package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2051287

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