Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Reexamination Certificate
2007-01-23
2007-01-23
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
C257S710000, C257S669000, C257SE23188
Reexamination Certificate
active
10952424
ABSTRACT:
A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.
REFERENCES:
patent: 4710744 (1987-12-01), Wamstad
patent: 4740410 (1988-04-01), Muller et al.
patent: 4800758 (1989-01-01), Knecht et al.
patent: 4872047 (1989-10-01), Fister et al.
patent: 4918032 (1990-04-01), Jain et al.
patent: 4948757 (1990-08-01), Jain et al.
patent: 5105258 (1992-04-01), Silvis et al.
patent: 5207102 (1993-05-01), Takahashi et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5273939 (1993-12-01), Becker et al.
patent: 5315155 (1994-05-01), O'Donnelly et al.
patent: 5336928 (1994-08-01), Neugebauer et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5515732 (1996-05-01), Wilcox et al.
patent: 5939633 (1999-08-01), Judy
patent: 5945605 (1999-08-01), Julian et al.
patent: 5994161 (1999-11-01), Bitko et al.
patent: 6137170 (2000-10-01), Ujiie et al.
patent: 6169328 (2001-01-01), Mitchel et al.
patent: 6309915 (2001-10-01), Distefano
patent: 6443179 (2002-09-01), Benavides et al.
patent: 6505511 (2003-01-01), Geen et al.
patent: 6617683 (2003-09-01), Lebonheur et al.
patent: 6667557 (2003-12-01), Alcoe et al.
patent: 6768196 (2004-07-01), Harney et al.
patent: 2001/0055836 (2001-12-01), Kunda
patent: 2004/0041254 (2004-03-01), Long et al.
patent: WO 91/05368 (1991-04-01), None
patent: WO 2004/022477 (2004-03-01), None
Blackwell, The Electronic Packaging Handbook, CRC Press LLC, pp. 2-3, 7-1, 7-3, 7-12, A-9, and A-11, 2000.
Brown, Advanced Electronic Packaging With Emphasis on Multichip Modules, Institute of Electrical and Electronics Engineers, Inc., pp. 4, 8, 568, 1999.
Tummala et al., Microelectronics Packaging Handbook Semiconductor Packaging Part II, Second Edition, Chapman & Hall, pp. II-12, 1997.
Pecht, Handbook of Electronic Package Design, Marcel Dekker, Inc., pp. 173, 179, 196, 210, 736, 744, 821, and 832, 1991.
Heuberger, Mikromechanik, Springer Verlag A.G., pp. 470-476, 1989. With Translation.
Department of Defense, Test Method Standard Microcircuits, FSC 5962, completed 1997.
Patent Abstracts of Japan, vol. 009, No. 216 (E-340), Sep. 3, 1985 & JP 60 077434 A (Mitsubishi Denki KK), May 2, 1985 abstract.
Patent Abstracts of Japan, vol. 1995, No. 09, Oct. 31, 1995 & JP 07 142518 A (Hitachi LTD), Jun. 2, 1995 abstract.
Patent Abstracts of Japan, vol. 1996, No. 09, Sep. 30, 1996 & JP 08 116007 A (NEC Corp.), May 7, 1996.
Patent Abstracts of Japan, vol. 017, No. 672 (E-1474), Dec. 10, 1993 & JP 05 226501 A (Nissan Motor Co. LTD), Sep. 3, 1993 abstract.
Patent Abstracts of Japan, vol. 012, No. 111 (E-598), Apr. 8, 1988 & JP 62 241355 A (Hitachi LTD; others: 01), Oct. 22, 1987 abstract.
Farrell Peter W.
Felton Lawrence E.
Hablutzel Nicole
Judy Michael W.
Karpman Maurice S.
Analog Devices Inc.
Bromberg & Sunstein LLP
Mandala Jr. Victor A.
Pert Evan
LandOfFree
Packaged microchip with premolded-type package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaged microchip with premolded-type package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged microchip with premolded-type package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3798905