4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Te-Tsung Chao

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Bonding method which prevents wire sweep and the wire...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Overhang support for a stacked semiconductor device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Process for separating dies on a wafer

Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2485304

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