Optical device and method for fabricating the same

Details Optical device and method for fabricating the same Optical device and method for fabricating the same

2005-04-11

2008-10-14

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S098000, C257S100000, C257S434000, C257S777000, C257SE23032

Reexamination Certificate

active

07436053

ABSTRACT:
An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

REFERENCES:
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patent: 6495895 (2002-12-01), Peterson et al.
patent: 6621616 (2003-09-01), Bauer et al.
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patent: 2003/0128442 (2003-07-01), Tanaka et al.
patent: 2005/0105860 (2005-05-01), Oono et al.
patent: 2005/0179102 (2005-08-01), Weiblen et al.
patent: 2000-58805 (2000-02-01), None
patent: 2002-43554 (2002-02-01), None

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