Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-06-14
2005-06-14
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S230000, C438S199000, C438S305000
Reexamination Certificate
active
06905923
ABSTRACT:
A method of fabricating an SMOS integrated circuit with source and drain junctions utilizes an offset gate spacer for N-type transistors. Ions are implanted to form the source and drain regions in a strained layer. The offset spacer reduces problems associated with Arsenic (As) diffusion on strained semiconductor layers. The process can be utilized for SMOS metal oxide semiconductor field effect transistors (MOSFETs). The strained layer can be a strained silicon layer formed above a germanium layer.
REFERENCES:
patent: 4727038 (1988-02-01), Watabe et al.
patent: 4745082 (1988-05-01), Kwok
patent: 4784718 (1988-11-01), Mitani et al.
patent: 5141890 (1992-08-01), Haken
patent: 5264382 (1993-11-01), Watanabe
patent: 5291052 (1994-03-01), Kim et al.
patent: 5374575 (1994-12-01), Kim et al.
patent: 5384285 (1995-01-01), Sitaram et al.
patent: 5391510 (1995-02-01), Hsu et al.
patent: 5429956 (1995-07-01), Shell et al.
patent: 5491099 (1996-02-01), Hsu
patent: 5593907 (1997-01-01), Anjum et al.
patent: 5595919 (1997-01-01), Pan
patent: 5624871 (1997-04-01), Teo et al.
patent: 5654212 (1997-08-01), Jang
patent: 5675159 (1997-10-01), Oku et al.
patent: 5716681 (1998-02-01), Moslehi
patent: 5716861 (1998-02-01), Moslehi
patent: 5736446 (1998-04-01), Wu
patent: 5825066 (1998-10-01), Buynoski
patent: 5856225 (1999-01-01), Lee et al.
patent: 5858843 (1999-01-01), Doyle et al.
patent: 5915182 (1999-06-01), Wu
patent: 5915196 (1999-06-01), Mineji
patent: 5998807 (1999-12-01), Lustig et al.
patent: 5998873 (1999-12-01), Blair et al.
patent: 6030863 (2000-02-01), Chang et al.
patent: 6153484 (2000-11-01), Donaton et al.
patent: 6184097 (2001-02-01), Yu
patent: 6356476 (2002-03-01), Kang
patent: 6365476 (2002-04-01), Talwar et al.
patent: 6444532 (2002-09-01), Hasegawa
patent: 6506654 (2003-01-01), Wei et al.
patent: 6559015 (2003-05-01), Yu
patent: 6649492 (2003-11-01), Chu et al.
patent: 6689671 (2004-02-01), Yu et al.
patent: 6762085 (2004-07-01), Zheng et al.
patent: 2001/0003364 (2001-06-01), Sugawara et al.
patent: 2003/0068883 (2003-04-01), Ajmera et al.
patent: 2003/0153161 (2003-08-01), Chut et al.
patent: 3-248433 (1990-02-01), None
patent: 4-123439 (1990-09-01), None
patent: 3248433 (1991-11-01), None
patent: 4123439 (1992-04-01), None
patent: 5160396 (1993-06-01), None
patent: 5-160396 (1993-06-01), None
patent: 10-270685 (1998-10-01), None
patent: 410270685 (1998-10-01), None
International Electron Devices Meeting 1997, “Sub-100nm Gate Length Metal Gate NMOS Transistors Fabricated by a Replacement Gate Process” by Chatterjee et al, pp. 821-824.
International Electron Devices Meeting 1999, “70nm MOSFET with Ultra-Shallow, Abrupt, and super-Doped S/D Extension Implemented by Laser Thermal Process (LPT)” by Yu et al, pp. 509-512.
Bin Yu, et al., 70nm MOSFET with Ultra-Shallow, Abrupt, and Super-Doped S/D Extension Implemented by Laser Thermal Process (LTP), 1999 International Electron Devices Meeting; Technical Digest, Washington, DC; Dec.5-8, 1999 (6 pgs.).
A. Chatterjee, et al., Sub-100nm Gate Length Metal Gate NMOS Transistors Fabricated by a Replacement Gate Process, 1997 International Electron Devices Meeting, Technical Digest, Washington, DC; Dec. 7-10, 1997 (5 pgs.).
Paton Eric N.
Wang Haihong
Xiang Qi
Advanced Micro Devices , Inc.
Foley & Lardner LLP
Novacek Christy
Zarabian Amir
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