Nonvolatile semiconductor memory device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S326000, C257SE29309, C257SE21423, C257SE21679, C257S314000, C438S264000, C365S185110

Reexamination Certificate

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07982261

ABSTRACT:
A nonvolatile semiconductor memory device includes a first stacked body on a silicon substrate, and a second stacked body is provided thereon. The first stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films, and a first portion of a through-hole extending in a stacking direction is formed. The second stacked body includes a plurality of insulating films alternately stacked with a plurality of electrode films, and a second portion of the through-hole is formed. A memory film is formed on an inner face of the through-hole, and a silicon pillar is buried in an interior of the through-hole. A central axis of the second portion of the through-hole is shifted from a central axis of the first portion, and a lower end of the second portion is positioned lower than an upper portion of the first portion.

REFERENCES:
patent: 2007/0252201 (2007-11-01), Kito et al.
patent: 2007-266143 (2007-10-01), None
patent: 2007317874 (2007-12-01), None
patent: 2009-146954 (2009-07-01), None
patent: WO 2009/075370 (2009-06-01), None
U.S. Appl. No. 12/851,054, Aug. 5, 2010, Katsumata, et al.
U.S. Appl. No. 12/851,002, Aug. 5, 2010, Katsumata, et al.

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