Nonvolatile memory devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S326000, C257S332000, C257SE27103, C257SE29129, C257SE29300

Reexamination Certificate

active

07859042

ABSTRACT:
Methods of fabricating a nonvolatile memory device include forming a trench mask pattern on a semiconductor substrate including a first region and a second region. Substrate trenches defining active regions are formed in the semiconductor substrate in the first region and the second region using the trench mask pattern as a mask. Device isolation layer patterns are formed on the semiconductor substrate including the trench mask pattern and substrate trenches. The device isolation patterns fill the substrate trenches in the first region and in the second region. First and second openings are formed exposing top surfaces of the corresponding active regions in the first and second regions by removing the trench mask pattern. The second opening has a greater width than the first opening. A first lower conductive pattern is formed in the first opening and has a bottom portion in a lower region of the first opening and an extended portion extending from the bottom portion to an upper region of the first opening. The extended portion has a smaller width than the bottom portion. A second lower conductive pattern is formed filling the second opening.

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patent: 2002-246845 (2002-08-01), None
patent: 1020030092997 (2003-12-01), None
patent: 1020040005230 (2004-01-01), None

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