Nested design approach

Details Nested design approach Nested design approach

2005-06-17

2008-01-29

Chiang, Jack (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

07325213

ABSTRACT:
A structure for a system of chip packages includes a master substrate and at least one subset substrate of the master substrate. The subset substrate includes a portion of the master substrate that has an identical pin out pattern as the portion of the master substrate. The subset substrate has identical internal net lists as the portion of the master substrate. The subset substrate is adapted to accommodate a smaller chip than the master substrate. The master substrate is the largest substrate in the system. The invention also prepares a system of chip packages. The invention selects a master substrate and then selects a subset substrate of the master substrate.

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