4. Metal fusion bonding
  5. Solder form

Marie S. Cole

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Interconnection structure and test method

Metal fusion bonding – Solder form
Patent

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Interconnection structure and test method

Metal fusion bonding – Process – Plural joints
Patent

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Low stress conductive polymer bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Low stress conductive polymer bump

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Nested design approach

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Profile ID: LFUS-PAI-P-947300

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