Multipurpose cap layer dielectric

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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438637, 438633, 438945, H01L 2144

Patent

active

061142352

ABSTRACT:
A multipurpose cap layer serves as a bottom anti-reflective coating (BARC) during the formation of a resist mask, a hardmask during subsequent etching processes, a hardened surface during subsequent deposition and planarization processes, and optionally as a diffusion barrier to mobile ions from subsequently deposited materials.

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