Multiple-depth STI trenches in integrated circuit fabrication

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having junction gate

Reexamination Certificate

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C438S207000, C438S218000, C438S221000, C438S248000, C438S295000, C438S318000, C438S353000, C438S355000, C438S359000, C438S391000, C438S400000, C438S404000, C438S405000, C438S412000, C257S093000, C257S374000, C257S446000, C257S501000, C257S506000

Reexamination Certificate

active

10931946

ABSTRACT:
Multiple trench depths within an integrated circuit device are formed by first forming trenches in a substrate to a first depth, but of varying widths. Formation of a dielectric layer can cause some of the trenches to fill or close off while leaving other, wider trenches open. Removal of a portion of the dielectric material can then be tailored to expose a bottom of the open trenches while leaving remaining trenches filled. Removal of exposed portions of the underlying substrate can then be used to selectively deepen the open trenches, which can subsequently be filled. Such methods can be used to form trenches of varying depths without the need for subsequent masking.

REFERENCES:
patent: 4609934 (1986-09-01), Haskell
patent: 4988639 (1991-01-01), Aomura
patent: 5179038 (1993-01-01), Kinney
patent: 5473186 (1995-12-01), Morita
patent: 5776817 (1998-07-01), Liang
patent: 5814547 (1998-09-01), Chang
patent: 5851928 (1998-12-01), Cripe
patent: 6175144 (2001-01-01), Gardner
patent: 6207534 (2001-03-01), Chan
patent: 6288426 (2001-09-01), Gauthier, Jr.
patent: 6294419 (2001-09-01), Brown
patent: 6294423 (2001-09-01), Malik
patent: 6596608 (2003-07-01), Saito
patent: 6737706 (2004-05-01), Lee
patent: 6815734 (2004-11-01), Horch
patent: 6864152 (2005-03-01), Mirbedini
patent: 2001/0010938 (2001-08-01), Bronner et al.
patent: 2001/0036705 (2001-11-01), Nishida
patent: 2003/0080379 (2003-05-01), Oikawa
patent: 2004/0029385 (2004-02-01), Manger
patent: 2004/0092115 (2004-05-01), Hsieh
patent: 2004/0188796 (2004-09-01), Karpov
patent: 2005/0020028 (2005-01-01), Liao et al.
patent: 2005/0130378 (2005-06-01), Huang
patent: 2005/0221616 (2005-10-01), Chen et al.
patent: 2005/0250335 (2005-11-01), Huang et al.
patent: 0 507 586 (1992-10-01), None
patent: 63144540 (1998-06-01), None

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