Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1994-08-31
1995-08-15
Kincaid, Kristine J.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174250, 174260, 174262, 361784, 361792, H05K 100
Patent
active
054421446
ABSTRACT:
A method of making a multilayered circuit board wherein at least two layered subassemblies, each comprising a dielectric layer and at least one conductive layer therein, are bonded together. Each subassembly includes a through-hole extending therethrough which is aligned with a respective through-hole of the other prior to bonding. The subassemblies are compressed at a predetermined pressure (e.g., 300 psi) and then heated to a first temperature (e.g., 300.degree. C.) for an established time period, resulting in formation of a bond between the two through-holes. The resulting alloy formed from this bond possesses a melting point significantly greater than that of the subassembly dielectric (e.g., PTFE). Following this time period, the compressed subassemblies are heated to an even greater temperature (e.g., 380.degree. C.), again for an established time period, to assure dielectric flow. The subassembly is then cooled and the pressure removed. The method possesses two significant features: (1) effective engagement between respective pairs of through-holes in the compressed subassemblies; and (2) prevention of dielectric incursion within the bond formed between the respective pairs of through-holes, which incursion could adversely affect the electrical connection therebetween.
REFERENCES:
patent: 2804414 (1957-08-01), Davis et al.
patent: 3648357 (1972-03-01), Green, Jr.
patent: 3678570 (1972-07-01), Paulonis et al.
patent: 4528072 (1985-07-01), Kurosawa et al.
patent: 4685210 (1987-08-01), King et al.
patent: 4778766 (1988-12-01), Burger et al.
patent: 4803450 (1989-02-01), Burgess et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4890784 (1990-01-01), Bampton
patent: 5038996 (1991-08-01), Wilcox et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5090609 (1992-02-01), Nakao et al.
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5142775 (1992-09-01), Wiley
patent: 5142775 (1992-09-01), Wiley
patent: 5147084 (1992-09-01), Behun et al.
patent: 5155302 (1992-10-01), Nguyen
patent: 5191174 (1993-03-01), Chang et al.
patent: 5199163 (1993-04-01), Ehrenberg et al.
patent: 5280414 (1994-01-01), Davis et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 12, May 1985, "Bonding Conductors to Microelectronic Devices and Packages", by J. Abney et al., pp. 7005-7008.
IBM Research Disclosure, No. 323, Mar. 1991, "Maintaining Dimensional Stability During Lamination", by J. Poetzinger et al.
Chen William T.
Gall Thomas P.
Wilcox James R.
Wu Tien Y.
Figlin Cheryl R.
Fraley Lawrence R.
International Business Machines - Corporation
Kincaid Kristine J.
LandOfFree
Multilayered circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayered circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2183395