Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Inventor
active
Electronic package having active means to maintain its operating
Encapsulated chip module and method of making same
Laminated electronic package including a power/ground assembly
Method for improving the adhesion of polymeric adhesives to nick
Method for making an encapsulated semiconductor chip module
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Profile ID: LFUS-PAI-P-430813