4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

James R. Wilcox

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Bonding of metallic surfaces

Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent

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Composite substrate for electronic components

Stock material or miscellaneous articles – Structurally defined web or sheet – Including components having same physical characteristic in...
Reexamination Certificate

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Conductor interconnect with dendrites through film

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Conductor interconnect with dendrites through film and...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Dendrite interconnect for planarization and method for producing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Profile ID: LFUS-PAI-P-516655

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