4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

William T. Chen

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Area array stud bump flip chip device and assembly process

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Construction of PBGA substrate for flip chip packing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Flexible supporting cable for an electronic device and method of

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Method and apparatus for forming a metallic feature on a...

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener
Reexamination Certificate

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Method of forming selective electroless plating on polymer...

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-114485

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