Multichip packages with exposed dice

Details Multichip packages with exposed dice Multichip packages with exposed dice

2006-12-05

2006-12-05

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S106000, C438S107000, C438S108000, C438S109000, C438S110000, C438S111000, C438S123000, C257S686000, C257S777000, C257S778000, C257S666000

Reexamination Certificate

active

07144800

ABSTRACT:
Multichip packages and methods for making same. The present invention generally allows for either the back of a flipchip, the back of a mother die, or both to be exposed in a multichip package. When the mother die is connected to the package contacts, the back of the flip chip is higher than the electrical connections. Accordingly, the back of the flip chip can be exposed. Furthermore, if a temporary tape substrate is used with a leadframe panel that does not have a die attach pad, the package can be even thinner. Once the temporary tape substrate is removed, both the back of the flipchip and the back of the mother die will be exposed from the encapsulant.

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“Tessara's Unique Approach to Stacked IC Packaging,” downloaded from: http://www.tessara.com/images
ews—events/Stacked—packaging—backgrounder—05-25-01.pdf on Feb. 4, 2003, 4 Pages.

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