Multi-layer polishing pad for low-pressure polishing

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S290000, C451S527000, C451S533000, C451S540000

Reexamination Certificate

active

08066552

ABSTRACT:
A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.

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