Multi-layer circuit having a via matrix interlayer connection an

Details Multi-layer circuit having a via matrix interlayer connection an Multi-layer circuit having a via matrix interlayer connection an

1998-02-19

2000-11-28

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438108, 438629, 438637, H01L 214763

Patent

active

061535087

ABSTRACT:
An interlayer connection for electrically connecting first and second conductive elements and reducing interlayer registration requirements is disclosed. The interlayer connection includes a first layer including a first electrically conductive element, a second layer including a second electrically conductive element, and a third layer disposed between the first layer and the second layer. The third layer includes an electrically insulative portion having a matrix of immediately adjacent vias therethrough. A selected plurality of immediately adjacent vias within the matrix are disposed between the first and the second electrically conductive elements and contain electrically conductive material forming a conductive path between the first and the second electrically conductive elements.

REFERENCES:
patent: 5227008 (1993-07-01), Klum et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5355019 (1994-10-01), Fuchs
patent: 5463250 (1995-10-01), Nguyen et al.
patent: 5468681 (1995-11-01), Pasch
patent: 5528080 (1996-06-01), Goldstein

Affiliated with

Also associated with

Rating

Multi-layer circuit having a via matrix interlayer connection an does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer circuit having a via matrix interlayer connection an, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer circuit having a via matrix interlayer connection an will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1725295