4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Paul Marlan Harvey

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Ball grid array package construction with raised solder ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Ball grid array package construction with raised solder ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Flex-based IC package construction employing a balanced...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Impedane measurement of chip, package, and board power...

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Electrical signal parameter measurement system
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Method of apparatus for interconnecting a relatively fine...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1638759

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