Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-04-10
2007-04-10
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE23042
Reexamination Certificate
active
10877165
ABSTRACT:
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die.
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Carney Francis J.
Celaya Phillip
Fauty Joseph K.
Letterman James P.
St. Germain Stephen
Dolan Jennifier M
Hightower Robert F
Jr. Carl Whitehead
Semiconductor Components Industries L.L.C.
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