4. Electronic digital logic circuitry
  5. Multifunctional or programmable
  6. Array

Paul Ying-Fung Wu

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active

Composite flip-chip package with encased components and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Ergonomically shaped computer pointing device

Computer graphics processing and selective visual display system – Display peripheral interface input device – Cursor mark position control device
Reexamination Certificate

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Lid and method of employing a lid on an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Lid and method of employing a lid on an integrated circuit

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Lid and method of employing a lid on an integrated circuit

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2397465

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