Multi-channel plasma discharge endpoint detection method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156345, 156643, 20419233, H01L 2100

Patent

active

051604027

ABSTRACT:
A plasma discharge endpoint detection system and method characterized by a plurality of individual data channels which are combined to create a composite function representative of the conditions within a plasma etch chamber. Preferably, a number of the channels are representative of spectral components within the optical spectrum caused by the plasma discharge within the etch chamber. A multi-channel sensor assembly is provided for this purpose including a number of light-guides for guiding light from the plasma discharge to filters and photosensors associated with the multiple channels. Other channels can detect various conditions such as the D.C. bias on a cathode within the plasma etch chamber. The various channels are digitized, weighted and summed within a digital computer to create the composite function from which endpoint and other conditions within the chamber can be determined. The method is characterized by the weighting and summing of a plurality of data channels carrying information about the conditions within a plasma etch chamber to develop a composite function and then analyzing the composite function to determine endpoint and other conditions. The endpoint detection method compares the slope of the composite function to a predetermined maximum slope value and identifies endpoint when the maximum slope value is exceeded a predetermined number of times.

REFERENCES:
patent: 4207137 (1980-06-01), Tretola
patent: 4312732 (1982-01-01), Degenkolb et al.
patent: 4609426 (1986-09-01), Ogawa et al.
patent: 4615761 (1986-10-01), Tada et al.
patent: 4695700 (1987-09-01), Provence
patent: 4720628 (1988-01-01), Drake
patent: 5045149 (1991-09-01), Nulty
Khoury, "Real-Time Etch Plasma Monitor System", IBM Technical Disclosure System, vol. 25, No. 11A, Apr. 1983.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-channel plasma discharge endpoint detection method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-channel plasma discharge endpoint detection method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-channel plasma discharge endpoint detection method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2048207

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.