Monitoring a metal layer during chemical mechanical polishing

Details Monitoring a metal layer during chemical mechanical polishing Monitoring a metal layer during chemical mechanical polishing

2007-06-12

2007-06-12

Shakeri, Hadi (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S041000, C451S285000

Reexamination Certificate

active

11355418

ABSTRACT:
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

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