Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1996-11-15
1999-06-08
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
2041921, 20419212, 20419232, 20429838, 156345, 118723MW, 427553, 427575, 427595, 216 69, H01L 2100, C23C 1650
Patent
active
RE0362247
ABSTRACT:
A microwave plasma processing process and apparatus useful in the fabrication of integrated circuit (IC) or similar semiconductor devices, wherein the object or material to be processed, such as a semiconductor wafer, is processed with plasma generated using microwaves transmitted through a microwave transmission window disposed perpendicular to an electric field of the progressive microwaves in the waveguide.
REFERENCES:
patent: 4101411 (1978-07-01), Suzuki et al.
patent: 4245154 (1981-01-01), Uehara et al.
patent: 4265730 (1981-05-01), Hirose et al.
patent: 4298419 (1981-11-01), Suzuki et al.
patent: 4316791 (1982-02-01), Taillet
patent: 4330384 (1982-05-01), Okudaira et al.
patent: 4339326 (1982-07-01), Hirose et al.
patent: 4431473 (1984-02-01), Okano et al.
patent: 4462863 (1984-07-01), Nishmatsu et al.
patent: 4512868 (1985-04-01), Fujimura
patent: 4563240 (1986-01-01), Shibata et al.
European Search Report, The Hague, Feb. 10, 1988.
Kraus, John D., Electromagnetics, 1973 pp. 482-485.
Fujimura Shuzo
Kisa Toshimasa
Motoki Yasunari
Fujitsu Limited
Nguyen Nam
VerSteeg Steven H.
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