4. Chemistry: electrical and wave energy
  5. Apparatus
  6. Coating, forming or etching by sputtering

Shuzo Fujimura

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Apparatus for fabricating semiconductor device and method for fa

Coating apparatus – Gas or vapor deposition – With treating means
Patent

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Apparatus for fabricating semiconductor device and method for fa

Adhesive bonding and miscellaneous chemical manufacture – Methods – Delaminating – per se; i.e. – separating at bonding face
Patent

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Apparatus for removing organic resist from semiconductor

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent

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Ashing method for removing an organic film on a substance of a s

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Ashing method for removing an organic film on a substance of a s

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-88714

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