Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1991-12-16
1992-12-29
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
333246, 333247, 361386, 361387, 361388, 361389, 174 35MS, 257709, 257728, 257772, H01L 2302, H01P 308, H02B 100, H05K 900
Patent
active
051756110
ABSTRACT:
A MIC package housing that reduces or completely eliminates alumina substrate cracking due to thermal expansion rate differences between the housing and the alumina by using a low-expansion iron-nickel alloy, such as commercially available Carpenter 49, made to ASTM Specification A-753-78 (Alloy 2) and MIL-N-14411B (MR) (Composition 3 and 4). Such a housing places compressive stresses no glass-to-metal seals used in hermetic feedthroughs and the glass is fused and the stresses relieved by a special process of annealing. Manufacturing yields are improved and very large alumina substrates can be used and are attached by hard soldering.
REFERENCES:
patent: 1184813 (1916-05-01), Birdsall
patent: 2065404 (1936-12-01), Scott
patent: 4985753 (1991-01-01), Fujioka et al.
Richardson, E. F., "Select Material to Balance . . . " Microwaves & RF, Jul. 1989, pp. 87-95.
"Carpenter Controlled-Expansion Alloys," brochure by Carpenter Steel Div., Reading, Pa.
Brody Paul J.
Richardson Eric F.
James Andrew J.
Jr. Carl Whitehead
Schatzel Thomas E.
Watkins-Johnson Company
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