4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Paul J. Brody

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Automated real-time data stream switching in a shared...

Electrical computers and digital processing systems: multicomput – Computer-to-computer protocol implementing – Computer-to-computer data streaming
Reexamination Certificate

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Microwave integrated circuit package to eliminate alumina substr

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Microwave integrated circuit package to eliminate alumina substr

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Profile ID: LFUS-PAI-P-1730023

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