4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Eric F. Richardson

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Microwave integrated circuit package to eliminate alumina substr

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
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Microwave integrated circuit package to eliminate alumina substr

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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