Micromachined assembly with a multi-layer cap defining a cavity

Details Micromachined assembly with a multi-layer cap defining a cavity Micromachined assembly with a multi-layer cap defining a cavity

2003-03-07

2009-02-17

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257SE31117, C257SE31119, C257SE23118

Reexamination Certificate

active

07492019

ABSTRACT:
This invention comprises a process for fabricating a micro mechanical structure in a sealed cavity having a multi-layer high stiffness cap. The high stiffness material used for the cap protects the underlying microstructure from destructive environmental forces inherent in the packaging process and from environmental damage.

REFERENCES:
patent: 5285131 (1994-02-01), Muller et al.
patent: 5493177 (1996-02-01), Muller et al.
patent: 5683591 (1997-11-01), Offenberg
patent: 6023091 (2000-02-01), Koch et al.
patent: 6118164 (2000-09-01), Seefeldt et al.
patent: 6555904 (2003-04-01), Karpman
patent: 6936494 (2005-08-01), Cheung
patent: 2004/0155320 (2004-08-01), DeJule et al.

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