Microelectronic die having a thermoelectric module

Details Microelectronic die having a thermoelectric module Microelectronic die having a thermoelectric module

2007-10-09

2007-10-09

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S712000, C257S720000

Reexamination Certificate

active

10638038

ABSTRACT:
A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias in the substrate interconnect the thermoelectric module with power and ground planes on the front side of the die substrate.

REFERENCES:
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 6094919 (2000-08-01), Bhatia
patent: 6803659 (2004-10-01), Suwa et al.
patent: 6893523 (2005-05-01), Gaynes et al.
patent: 2004/0118129 (2004-06-01), Chrysler et al.

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