Micro-fluidic injection molded solder (IMS)

Details Micro-fluidic injection molded solder (IMS) Micro-fluidic injection molded solder (IMS)

2011-07-19

2011-07-19

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

C228S256000, C228S180210, C228S180220, C222S251000, C222S288000, C222S564000, C222S591000

Reexamination Certificate

active

07980446

ABSTRACT:
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

REFERENCES:
patent: 3964509 (1976-06-01), Daubenberger et al.
patent: 4693209 (1987-09-01), Leicht
patent: 4720402 (1988-01-01), Wojcik
patent: 4934309 (1990-06-01), Ledermann et al.
patent: 5244143 (1993-09-01), Ference et al.
patent: 5478700 (1995-12-01), Gaynes et al.
patent: 5545465 (1996-08-01), Gaynes et al.
patent: 5673846 (1997-10-01), Gruber
patent: 5878939 (1999-03-01), Luchinger et al.
patent: 6056191 (2000-05-01), Brouillette et al.
patent: 6395087 (2002-05-01), Jairazbhoy et al.
patent: 6638363 (2003-10-01), Erdmann
patent: 2005/0263571 (2005-12-01), Belanger et al.
patent: 2007/0246515 (2007-10-01), Cordes et al.
patent: 2007/0272389 (2007-11-01), Gruber et al.
patent: 08-228073 (1996-09-01), None
U. S. Appl. No. 11/869,573, filed Oct. 9, 2007 and entitled “Sprocket Opening Alignment Process and Apparatus for Multilayer Solder Decal.”
U. S. Appl. No. 11/696,753, filed Apr. 5, 2007 and entitled “Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling.”
Gruber et al., Low-cost wafer bumping, IBM J. Res. & Dev. vol. 49, No. 4/5 Jul./Sep. 2005.
U. S. Appl. No. 12/269,240, filed Nov. 12, 2008 and entitled “Injection Molded Solder Method for Forming Solder Bumps on Substrates.”

Affiliated with

Also associated with

Rating

Micro-fluidic injection molded solder (IMS) does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micro-fluidic injection molded solder (IMS), we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-fluidic injection molded solder (IMS) will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2692196