4. Heat exchange
  5. With retainer for removable article
  6. Electrical component

Peter A. Gruber

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Apparatus and method for filling high aspect ratio via holes...

Metal fusion bonding – Process – Applying or distributing fused filler
Reexamination Certificate

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Apparatus and method for injection molding solder and applicatio

Metal fusion bonding – Process – Plural joints
Patent

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Apparatus for filling high aspect ratio via holes in...

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock...
Reexamination Certificate

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Bilayer wafer-level underfill

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Cast metal seal for semiconductor substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Profile ID: LFUS-PAI-P-481736

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