4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Jae-Woong Nah

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Die level integrated interconnect decal manufacturing method...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Injection molded solder method for forming solder bumps on...

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Method and apparatus for forming planar alloy deposits on a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method and apparatus for forming planar alloy deposits on a...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Micro-fluidic injection molded solder (IMS)

Metal fusion bonding – Including means to apply flux or filler to work or applicator
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2218486

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