4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Paul A. Lauro

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Cooling apparatus and method of fabrication thereof with a...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Cooling apparatus with cold plate formed in situ on a...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electrical connector design and contact geometry and method...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Injection molded solder method for forming solder bumps on...

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Interconnection for flip-chip using lead-free solders and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-395948

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