Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Electron beam imaging
Reexamination Certificate
2006-01-31
2008-08-05
Young, Christopher G (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Electron beam imaging
C430S328000, C430S330000, C430S942000
Reexamination Certificate
active
07407736
ABSTRACT:
Methods for improving a single layer resist (SLR) patterning scheme, and in particular, its SLR layer and anti-reflective coating (ARC) etch selectivity, are disclosed. In one method, a patterned SLR layer over an anti-reflective coating (ARC) is provided and at least a portion of the patterned SLR layer and a portion of the ARC are exposed to radiation. The radiation may include, for example, an electron beam or an ion beam. The radiation exposure selectively breaks the polymer chains of the ARC and reduces the thickness of the ARC due to the loss of volatile function groups and free volume. As a result, the etch rate of the ARC is increased due to the conversion from polymer to monomer. Therefore, less resist will be consumed during, for example, an ARC open etch.
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Chung-Hsi J. Wu, et al., “Investigation on the Mechanism of the 193nm Resist Linewidth Reduction During the SEM Measurement”, Proceedings of SPIE, vol. 4345 (2001).
Chen Kuang-Jung J.
Huang Wu-Song S.
Wu Chung-Hsi J.
Hoffman Warnick LL
International Business Machines - Corporation
Petrokaitis Joseph
Young Christopher G
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