Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Plasma
Reexamination Certificate
2006-06-14
2008-11-11
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Plasma
C977S890000
Reexamination Certificate
active
07449398
ABSTRACT:
In a method for forming silicon nano-crystals using plasma ion implantation and a semiconductor memory device using the same, silicon nano-crystals may be formed using plasma ion implantation. An insulating layer may be formed on a substrate, and ions may be implanted into the insulating layer using hydrogen and a gas including silicon. Silicon nano-crystals may be formed using a heat treatment.
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Fast and Long Retention-Time Nano-Crystal Memory□□Hussein I. Hanafi Sandip Tiwari Imran Khan, Sep. 1996, IEEE, IEEE Transactions on Electron Devices vol. 43 No. 9 pp. 1553-1558.
Effects of Ion Bombardment upon Microcrystalline Silicon Growth□□B. Kalache, R. Brenot, V. Tripathi, S. Kumar, R. Vanderhaghen, P. Rocia I. Cabarrocas, 2001, Scitec Publications, Switzerland, Solid State Phenomena vols. 80-81, pp. 71-76.
Korean Office Action for counterpart Korean Application No. 10-2005-0051995 dated Aug. 30, 2006.
English Translation of Korean Office Action for counterpart Korean Application No. 10-2005-0051995 dated Aug. 30, 2006.
Chhaya Swapneel
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
Wilczewski M.
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