Methods of forming semiconductor devices

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Plasma

Reexamination Certificate

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C438S197000, C438S719000, C438S753000, C257SE21027, C257SE21042, C257SE21043, C257SE21051, C257SE21058, C257SE21077, C257SE21227, C257SE21231, C257SE21248, C257SE21267, C257SE21247

Reexamination Certificate

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08048787

ABSTRACT:
Provided are a semiconductor device and a method of forming the same. The method may include forming a gate dielectric layer including a plurality of elements on a substrate; supplying a specific element to the gate dielectric layer; forming a product though reacting the specific element with at least one of the plurality of elements; and removing the product.

REFERENCES:
patent: 2005/0006675 (2005-01-01), Tsunashima et al.
patent: 2007/0134867 (2007-06-01), Sadd et al.
patent: 2008/0017930 (2008-01-01), Kim et al.
patent: 2008/0029805 (2008-02-01), Shimamoto et al.
patent: 2001-257344 (2001-09-01), None
patent: 2001-291864 (2001-10-01), None
patent: 2006-157015 (2006-06-01), None
patent: 1020010088450 (2001-09-01), None
patent: 1020030093803 (2003-12-01), None
patent: 1020060093618 (2006-08-01), None

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