Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2005-11-29
2005-11-29
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C257S315000
Reexamination Certificate
active
06969650
ABSTRACT:
Gate structures of a non-volatile integrated circuit memory device can include a thermal oxidation layer on a substrate beneath the gate structure that defines a side wall of the gate structure. An oxygen diffusion barrier layer is on the side wall of the gate structure and a floating gate is on the thermal oxidation layer and has a curved side wall portion. Related methods are also discussed.
REFERENCES:
patent: 5208174 (1993-05-01), Mori
patent: 6027971 (2000-02-01), Cho et al.
patent: 6030869 (2000-02-01), Odake et al.
patent: 6232184 (2001-05-01), Wang et al.
patent: 2002/0106859 (2002-08-01), Odake et al.
patent: 2002/0187609 (2002-12-01), Kim et al.
patent: 2003/0181053 (2003-09-01), Tseng et al.
patent: 06-077493 (1994-03-01), None
patent: 2002-033404 (2002-01-01), None
English Translation of Official Letter from German Patent Office; German Patent Application No. 103 41 062.7-33, dated Dec. 6, 2004.
English Translation of Korean Office Action; Korean Patent Application No. 10-2002-0054460, Date of Korean Office Action Jul. 30, 2004.
Shin Jin-hyun
Yun Jae-sun
Le Thao P.
Myers Bigel & Sibley Sajovec, PA
Samsung Electronics Co,. Ltd.
LandOfFree
Methods of forming gate structures in nonvolatile memory... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of forming gate structures in nonvolatile memory..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming gate structures in nonvolatile memory... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3521299