Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2011-08-30
2011-08-30
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257SE21499, C257S434000, C257S681000, C438S116000
Reexamination Certificate
active
08008762
ABSTRACT:
Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
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Bolken Todd O.
Cobbley Chad A.
Chu Chris
Lerner David Littenberg Krumholz & Mentlik LLP
Round Rock Research, LLC
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