Methods of fabricating semiconductor device having T-shaped...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S596000, C257SE21205

Reexamination Certificate

active

07101766

ABSTRACT:
There are provided methods of fabricating a semiconductor device having a T-shaped gate and an L-shaped spacer. In the method, an insulating layer and a sacrificial layer are formed in sequence on a semiconductor substrate having a vertical gate pattern. By etching the sacrificial layer, a sacrificial spacer is formed. By etching the insulating layer until an upper surface of at least the vertical gate pattern is exposed, there is formed an L-shaped spacer, which includes a vertical portion located between sidewalls of the vertical gate pattern and the sacrificial spacer, and a horizontal portion extended from the vertical portion and located between the semiconductor substrate and the sacrificial spacer. By selectively etching a part of the vertical portion of the L-shaped spacer, an empty space is formed between upper sidewalls of the vertical gate pattern and the sacrificial spacer. A horizontal gate pattern, which is formed of a conductive layer to fill at least the empty space, is formed, and thus, there is formed a T-shaped gate being composed of the vertical gate pattern and the horizontal gate pattern.

REFERENCES:
patent: 4599790 (1986-07-01), Kim et al.
patent: 5290720 (1994-03-01), Chen
patent: 5920783 (1999-07-01), Tseng et al.
patent: 6087234 (2000-07-01), Wu
patent: 6541328 (2003-04-01), Whang et al.
patent: 03-50792 (2003-06-01), None

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