Methods of fabricating gates for integrated circuit field effect

Details Methods of fabricating gates for integrated circuit field effect Methods of fabricating gates for integrated circuit field effect

1999-09-21

2000-12-12

Pham, Long

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

438530, 438532, 438592, 438593, 438653, 438657, H01L 21336

Patent

active

061598100

ABSTRACT:
Gate electrodes for integrated circuit field effect transistors are fabricated by forming a polysilicon layer on a gate insulating layer opposite an integrated circuit substrate, forming an amorphous impurity layer on the polysilicon layer opposite the gate insulating layer, and forming an amorphous silicon layer on the amorphous impurity layer opposite the polysilicon layer. The amorphous silicon layer, the amorphous impurity layer and the polysilicon layer are patterned to define a gate electrode pattern. The polysilicon layer, the amorphous impurity layer and the amorphous silicon layer then are converted into a polysilicon gate having a first surface adjacent the gate insulating layer, a second surface opposite the gate insulating layer, and a buried doped layer within the polysilicon gate electrode that is spaced apart from the first and second surfaces thereof. The converting preferably takes place by thermally treating the gate electrode pattern. By using amorphous silicon for the outer portion of the gate insulating layer, patterning can be provided effectively. Moreover, since polysilicon is initially provided adjacent the gate insulating layer, stresses, cracking and/or defects may be reduced when thermally treating the gate electrode pattern to form the polysilicon gate.

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patent: 5614428 (1997-03-01), Kapoor
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patent: 5837598 (1998-11-01), Aronowitz et al.
Wolf et al., Silicon Processing for the VLSI Era, vol. 1: Process Technology, Lattice Press, 1986, p. 8.

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