Methods of fabricating and testing silver-tin alloy solder bumps

Details Methods of fabricating and testing silver-tin alloy solder bumps Methods of fabricating and testing silver-tin alloy solder bumps

1998-04-21

2000-01-11

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438652, 438658, 438686, 257738, 257762, 257772, H01L 2144, H01L 2348

Patent

active

060135727

ABSTRACT:
Silver-tin alloy solder bumps are fabricated by forming a masked underbump metallurgy layer on a microelectronic substrate, to define exposed portions of the underbump metallurgy layer, plating silver on the exposed portions of the underbump metallurgy, plating tin on the silver and reflowing to form silver-tin alloy solder bumps. Accordingly, silver-tin alloy is not plated. Rather, individual layers of silver and tin are plated, and then reflowed to form silver-tin alloy solder bumps.

REFERENCES:
patent: 5208186 (1993-05-01), Mathew
patent: 5418186 (1995-05-01), Park
patent: 5928404 (1999-07-01), Paruchuri

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