4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Jong-han Park

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Accounting processor and method for automated management control

Data processing: financial – business practice – management – or co – Automated electrical financial or business practice or... – Accounting
Patent

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Double side image scanner

Facsimile and static presentation processing – Facsimile – Picture signal generator
Reexamination Certificate

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Method for manufacturing a bump on a semiconductor chip

Fishing – trapping – and vermin destroying
Patent

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Methods of fabricating and testing silver-tin alloy solder bumps

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Silver-tin alloy solder bumps

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1480292

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