4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates

Shinobu Kourakata

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Adhesive of folded package

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate

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Methods and systems for attaching die in stacked-die packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2904107

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