Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-31
2006-10-31
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S692000, C438S694000, C438S758000, C438S508000, C134S001300, C134S002000
Reexamination Certificate
active
07129167
ABSTRACT:
A method of cleaning a substrate includes receiving a substrate and applying a stress-free cleaning process to the top surface of the substrate. The substrate includes a top surface that is substantially free of device dependent planarity nonuniformities and device independent planarity nonuniformities. The top surface also includes a first material and a device structure formed in the first material, the device structure being formed from a second material. The device structure has a device surface exposed. The device surface has a first surface roughness. A system for stress-free cleaning a substrate is also described.
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Bailey III Andrew D.
Kim Yun-sang
Lohokare Shrikant P.
McClatchie Simon
LAM Research Corporation
Le Dung A.
Martine & Penilla & Gencarella LLP
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