Methods and apparatus for incorporating nitrogen in oxide films

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C438S513000, C438S520000, C438S528000, C118S7230AN, C118S7230ER

Reexamination Certificate

active

07902050

ABSTRACT:
In a first aspect, a first method is provided. The first method includes the steps of (1) preconditioning a process chamber with an aggressive plasma; (2) loading a substrate into the process chamber; and (3) performing plasma nitridation on the substrate within the process chamber. The process chamber is preconditioned using a plasma power that is at least 150% higher than a plasma power used during plasma nitridation of the substrate. Numerous other aspects are provided.

REFERENCES:
patent: 6068729 (2000-05-01), Shrotriya
patent: 6432255 (2002-08-01), Sun et al.
patent: 6626188 (2003-09-01), Fitzsimmons et al.
patent: 2002/0006736 (2002-01-01), Moore
patent: 2002/0110700 (2002-08-01), Hein et al.
patent: 2002/0168847 (2002-11-01), Narwankar et al.
patent: 2003/0066487 (2003-04-01), Suzuki
patent: 2005/0196954 (2005-09-01), Noguchi
patent: 2007/0141856 (2007-06-01), Sato et al.
patent: WO 99/03312 (1999-01-01), None
patent: WO 00/22664 (2000-04-01), None
patent: WO 2006/130838 (2006-07-01), None
International Search Report and Written Opinion of International Application No. PCT/US2006/021498 (10249/PCT) mailed on Jan. 22, 2007.
International Preliminary Report on Patentability of International Application No. PCT/US2006/021498 (10249/PCT) mailed on Dec. 21, 2007.
Office Action for South Korean Patent Application No. 10-2007-7030121 (10249/PCT/SK) dated Aug. 14, 2009.
Jan. 28, 2010 Response to Office Action of U.S. Appl. No. 11/493,193 (10249/C01) Mailed Oct. 28, 2009.
Aug. 12, 2010 Response to Office Action of U.S. Appl. No. 11/493,193 (10249/C01) Mailed May 13, 2010.
Notice of Allowance of U.S. Appl. No. 11/493,193 Mailed Oct. 21, 2010.

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