Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Reexamination Certificate
2006-03-21
2006-03-21
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
C216S002000, C216S011000, C428S161000, C427S457000, C427S458000
Reexamination Certificate
active
07014786
ABSTRACT:
A method for forming a patterned film on a substrate, the method including: providing a first flowable medium on the substrate and a second flowable medium on the first flowable medium, the first and second flowable media having different dielectric properties and defining an interface there between; applying an electric field to the interface for a time sufficient to produce a structure in the first flowable medium along the interface: and hardening the structure in the first flowable medium to form the patterned film.
REFERENCES:
patent: 3791906 (1974-02-01), Farkas
patent: 4119688 (1978-10-01), Hiraoka
patent: 4144300 (1979-03-01), Breeden
patent: 5290717 (1994-03-01), Shimazu
patent: 5817374 (1998-10-01), Detig et al.
patent: 6391217 (2002-05-01), Schaffer et al.
patent: 2000-015175 (2000-01-01), None
Böltau et al., “Surface-Induced Structure Formation of Polymer Blends on Patterned Substrate,” Nature, Macmillan Journals Ltd. London, GB, 391:6670-877-879, Feb. 26, 1998.
Stephen Y. Chou et al., Lithography Induced Self-Construction of Polymer Microstructures for Resistless Patterning,38 Applied Physics Letters, 75:7:1004-1006, Aug. 16, 1999.
K. Dalnoki-Veress et al., “Dispersion-Driven Morephology of Mechanically Confined Polymer Films,” Physical Review Letters, 82:7:1486-1489, Feb. 15, 1999.
Robert F. Service, “Patterning Plastic With Plentiful Pillars,” Science, vol. 286, p. 1067, Nov. 5, 1999.
Aharoni-Hazan, et al., “Electric Filed Induced Pattern Formation In Interfacial Metal Colloid Films”,PhysicaA 200:189-199 (1993).
Mlynek Jurgen
Russell Thomas P.
Schaffer Erik
Steiner Ullrich
Thurn-Albrecht Thomas
Ahmed Shamim
Fish & Richardson P.C.
Universitat Konstanz
University of Massachusetts
LandOfFree
Methods and apparatus for forming submicron patterns on films does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods and apparatus for forming submicron patterns on films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for forming submicron patterns on films will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3548917