Methods and apparatus for e-beam treatment used to fabricate...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S781000, C427S255280, C257S632000, C257SE23077

Reexamination Certificate

active

11045650

ABSTRACT:
One embodiment of the present invention is a method for fabricating a low-k dielectric film that included steps of: (a) chemical vapor depositing a lower-k dielectric film; and (b) e-beam treating the lower-k dielectric film.

REFERENCES:
patent: 5000113 (1991-03-01), Wang et al.
patent: 5003178 (1991-03-01), Livesay
patent: 5028566 (1991-07-01), Lagendijk
patent: 5468595 (1995-11-01), Livesay
patent: 5554570 (1996-09-01), Maeda et al.
patent: 5776990 (1998-07-01), Hedrick et al.
patent: 5989998 (1999-11-01), Sugahara et al.
patent: 6051321 (2000-04-01), Lee et al.
patent: 6054379 (2000-04-01), Yau et al.
patent: 6057251 (2000-05-01), Goo et al.
patent: 6068884 (2000-05-01), Rose et al.
patent: 6080526 (2000-06-01), Yang et al.
patent: 6132814 (2000-10-01), Livesay et al.
patent: 6159871 (2000-12-01), Loboda et al.
patent: 6195246 (2001-02-01), Livesay et al.
patent: 6204201 (2001-03-01), Ross
patent: 6207555 (2001-03-01), Ross
patent: 6271146 (2001-08-01), Ross
patent: 6303047 (2001-10-01), Aronitz et al.
patent: 6312793 (2001-11-01), Grill et al.
patent: 6316063 (2001-11-01), Andideh et al.
patent: 6340628 (2002-01-01), Van Cleemput et al.
patent: 6352945 (2002-03-01), Matsuki et al.
patent: 6383955 (2002-05-01), Matsuki et al.
patent: 6410463 (2002-06-01), Matsuki
patent: 6432846 (2002-08-01), Matsuki
patent: 6437443 (2002-08-01), Grill et al.
patent: 6441491 (2002-08-01), Grill et al.
patent: 6444136 (2002-09-01), Liu et al.
patent: 6455445 (2002-09-01), Matsuki
patent: 6479110 (2002-11-01), Grill et al.
patent: 6486082 (2002-11-01), Cho et al.
patent: 6500773 (2002-12-01), Gaillard et al.
patent: 6509259 (2003-01-01), Wang et al.
patent: 6514880 (2003-02-01), Matsuki et al.
patent: 6524974 (2003-02-01), Sukharev
patent: 6541367 (2003-04-01), Mandal
patent: 6548899 (2003-04-01), Ross
patent: 6582777 (2003-06-01), Ross et al.
patent: 6583048 (2003-06-01), Vincent et al.
patent: 6583071 (2003-06-01), Weidman
patent: 6593655 (2003-07-01), Loboda et al.
patent: 6596627 (2003-07-01), Mandal
patent: 6605549 (2003-08-01), Leu et al.
patent: 6652922 (2003-11-01), Forester et al.
patent: 6677253 (2004-01-01), Andideh et al.
patent: 6703302 (2004-03-01), Miyajima et al.
patent: 6716770 (2004-04-01), O'Neill et al.
patent: 6734533 (2004-05-01), Wong
patent: 6737365 (2004-05-01), Kloster et al.
patent: 6756085 (2004-06-01), Waldfried et al.
patent: 6776990 (2004-08-01), Sachs et al.
patent: 6825130 (2004-11-01), Todd
patent: 6846515 (2005-01-01), Vrtis et al.
patent: 6852650 (2005-02-01), Matsuki et al.
patent: 6852777 (2005-02-01), Nakano et al.
patent: 6858697 (2005-02-01), Mayorga et al.
patent: 6893985 (2005-05-01), Goodner
patent: 7049247 (2006-05-01), Gates et al.
patent: 2002/0037442 (2002-03-01), Grill et al.
patent: 2002/0098714 (2002-07-01), Grill et al.
patent: 2002/0142579 (2002-10-01), Vincent et al.
patent: 2002/0142585 (2002-10-01), Mandal
patent: 2002/0160626 (2002-10-01), Matsuki et al.
patent: 2002/0172766 (2002-11-01), Laxman et al.
patent: 2002/0180051 (2002-12-01), Grill et al.
patent: 2002/0197849 (2002-12-01), Mandal
patent: 2003/0017718 (2003-01-01), Aoi
patent: 2003/0040195 (2003-02-01), Chang et al.
patent: 2003/0049460 (2003-03-01), Walfried et al.
patent: 2003/0054115 (2003-03-01), Albano et al.
patent: 2003/0064154 (2003-04-01), Laxman et al.
patent: 2003/0064607 (2003-04-01), Leu et al.
patent: 2003/0064746 (2003-04-01), Rader et al.
patent: 2003/0089998 (2003-05-01), Aoi
patent: 2003/0104689 (2003-06-01), Shioya et al.
patent: 2003/0104708 (2003-06-01), Cho et al.
patent: 2003/0109136 (2003-06-01), Shioya et al.
patent: 2003/0111712 (2003-06-01), Andideh
patent: 2003/0116421 (2003-06-01), Xu et al.
patent: 2003/0176030 (2003-09-01), Tsuji et al.
patent: 2003/0198742 (2003-10-01), Vrtis et al.
patent: 2003/0211244 (2003-11-01), Li et al.
patent: 2003/0211728 (2003-11-01), Mandal
patent: 2003/0224593 (2003-12-01), Wong
patent: 2003/0232137 (2003-12-01), Vrtis et al.
patent: 2003/0232495 (2003-12-01), Moghadam et al.
patent: 2004/0038514 (2004-02-01), Hyodo et al.
patent: 2004/0039219 (2004-02-01), Chen et al.
patent: 2004/0058090 (2004-03-01), Walfried et al.
patent: 2004/0076764 (2004-04-01), Forester et al.
patent: 2004/0096593 (2004-05-01), Lukas et al.
patent: 2004/0096672 (2004-05-01), Lukas et al.
patent: 2004/0099283 (2004-05-01), Walfried et al.
patent: 2004/0101632 (2004-05-01), Zhu et al.
patent: 2004/0101633 (2004-05-01), Zheng et al.
patent: 2004/0102006 (2004-05-01), Xu et al.
patent: 2004/0137758 (2004-07-01), Li et al.
patent: 2004/0166240 (2004-08-01), Rhee et al.
patent: 2004/0175501 (2004-09-01), Lukas et al.
patent: 2004/0175957 (2004-09-01), Lukas et al.
patent: 2004/0195693 (2004-10-01), Kloster et al.
patent: 2004/0197474 (2004-10-01), Vrtis et al.
patent: 2005/0038276 (2005-02-01), Laxman et al.
patent: 2005/0064726 (2005-03-01), Reid et al.
patent: 0 935 283 (1999-11-01), None
patent: 1 354 980 (2003-10-01), None
patent: WO 97/00535 (1997-01-01), None
patent: WO 99/21706 (1999-05-01), None
patent: WO 01/29052 (2001-04-01), None
patent: WO 01/61737 (2001-08-01), None
patent: WO 03/005429 (2003-01-01), None
patent: WO 03/095702 (2003-11-01), None
patent: WO 01/48805 (2004-07-01), None
PCT International Search Report for PCT/US03/14272, dated Jan. 21, 2004 (AMAT/7034.PC).
PCT Written Opinion; PCT/US03/14272, May 8, 2003.
PCT International Search Report and Written Opinion for PCT/US2005/003425, dated May 6, 2005 (AMAT/7034.PC.02).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods and apparatus for e-beam treatment used to fabricate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods and apparatus for e-beam treatment used to fabricate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods and apparatus for e-beam treatment used to fabricate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3870468

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.